A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Silicon-based electronics are approaching their physical limitations and new materials are needed to keep up with current technological demands. Two-dimensional (2D) materials have a rich array of ...

Flat materials that can morph into three-dimensional shapes have potential applications in architecture, medicine, robotics, space travel, and much more. But programming these shape changes requires ...

Controlled synthesis of metastable materials is a major focus in materials chemistry, with metastable thin films often synthesized through rapid condensation of vapor precursors. However, achieving ...

3D micro-/nanofabrication holds the key to build a large variety of micro-/nanoscale materials, structures, devices, and systems with unique properties that do not manifest in their 2D planar ...