South Korean chipmaker SK hynix Inc. said Monday it has begun mass production of a new quadruple level cell (QLC) NAND flash ...

ULTRARAM is a dual-use technology invented at Lancaster. It combines the data storage capability found in flash memory with ...

With rapid growth acceleration in the space economy, Micron Technology, Inc. (NASDAQ:MU) announced the launch of the industry’s highest-density, radiation-tolerant SLC NAND flash memory on July ...

Sandisk and SK hynix announced that they would work together to create standards for high bandwidth NAND flash, HBF modules.

Kioxia Corporation today announced that it has begun sampling new UFS Ver. 4.1 embedded memory devices designed for automotive applications.

The Next Generation of 3D NAND: Cell Stacking and Cell Scaling In the years to come, the memory industry will push the GAA-based 3D NAND flash roadmap to its ultimate limits.

Embedded systems such as Internet of Things (IoT) devices and single-board computers possess limited memory and processing ...

Initially, embedded floating-gate flash memory was widely used despite the large number of mask adder required (which translates to manufacturing cost) and the challenges in preserving the baseline ...

TMO: Transparent Memory Offloading in Datacenters,” answers key questions about memory-tier management in warehouse-scale computers. Large warehouse-scale computers (WSCs) underpin all the cloud ...

The US government has imposed fresh export controls on the sale of high tech memory chips used in artificial intelligence (AI) applications to China. The rules apply to US-made high bandwidth ...

KIOXIA’s 8th generation BiCS FLASH 3D flash memory introduces CBA (CMOS directly Bonded to Array) technology - an architectural innovation that marks a step-change in flash memory design.