BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...

Experienced high-speed PCB design and layout engineering is a major requirement for correctly partitioning a BGA on a PCB. Ideally, this expertise should be inextricably intertwined among chip vendors ...

So, you’re trying to get a handle on BGA flip chip tech? It’s one of those things that sounds complicated, but once you break ...

Recently, we stumbled upon a video by [iBoff], adding an M.2 NVMe port to a 2011-2013 MacBook. Apple laptops never came with proper M.2 ports, especially the A1278 – so what’s up? The trick is – ...

Diagram of a ball grid array (BGA). Engineers can use digital image correlation (DIC) to assess its thermal expansion or warpage due to thermal, mechanical and thermo-mechanical loads. DIC is an ...

Memory chip packaging designs changed significantly when the industry moved from SDR to DDR. Some common DRAM packaging includes Thin Small-Outline Package (TSOP), Chip-Scale Packaging (CSP), ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Computer hardware gets better, faster, and cheaper as time goes by. This is particularly true of portable computing devices such as the Dell XPS notebook we are looking at today. What we are ...

When you can buy something at a low price in one location, and sell it at a higher price somewhere else, you’re engaged in what economists call “arbitrage”. We’re not sure if desoldering DDR5 chips ...