At SEMICON Taiwan 2025, we spotlight three industry leaders shaping the future of semiconductors: ASMPT showcases its theme “Empower the Intelligence Revolution” with cutting-edge semiconductor assembly and packaging solutions, including the new ALSI LASER Platform, AERO PRO wire bonding, and the SIPLACE CA2 hybrid assembly system. ICP DAS presents solutions for zero downtime and sustainable manufacturing, such as the iWSN Wireless Power Meters, IRT Infrared Modules, and the RIO-9830 Redundant I